Effects of N2 Pretreatment on Performance and Stabilities of Power p-GaN HEMTs

Zhen Hong Huang, Chia Hao Chang, Wei Syuan Lin, Ting Chun Lo, Ying Chi Ching, Yu Jen Huang, Robin Christine Hwang, Chin Wen Chou, Tian Li Wu*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

In this work, we study the effect of N2 surface treatment on the performance and reliability of p-GaN gate high-electron-mobility-transistor (HEMT). The results indicate that N2 plasma pretreatment is effective in achieving stable threshold voltage, reducing the off-state leakage current and improving the HTRB stability in power p-GaN HEMTs.

Original languageEnglish
Title of host publication2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798350301649
DOIs
StatePublished - 2023
Event2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023 - Pulau Pinang, Malaysia
Duration: 24 Jul 202327 Jul 2023

Publication series

NameProceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA
Volume2023-July

Conference

Conference2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023
Country/TerritoryMalaysia
CityPulau Pinang
Period24/07/2327/07/23

Keywords

  • HTRB
  • p-GaN HEMT
  • plasma pretreatment

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