Abstract
In this letter, microwave annealing technology is proposed to reduce thermal budget for the manufacture of transparent conductive oxide thin-film transistor (TFT). With microwave annealing, a nitrogenated amorphous In-Ga-Zn-O (a-IGZO:N) TFT fabricated on glass panel behaves as a carrier mobility of 4.21 cm 2 V s and threshold voltage of 2.91 V. The performance of microwave-treated a-IGZO:N TFT with annealing process duration of 300 s is well competitive with its counterpart treated by thermal furnace annealing at 350 C for 1 h. Owing to its low thermal budget and selective heating to materials of interest, the microwave annealing has great potential for flexible oxide TFT applications.
Original language | English |
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Article number | 6564440 |
Pages (from-to) | 1157-1159 |
Number of pages | 3 |
Journal | IEEE Electron Device Letters |
Volume | 34 |
Issue number | 9 |
DOIs | |
State | Published - Sep 2013 |
Keywords
- Flexible thin-film transistor (TFT)
- In-Ga-Zn-O thin-film transistor (IGZO TFT)
- postannealing