Effective strategy for porous organosilicate to suppress oxygen ashing damage

Po-Tsun Liu; T. C. Chang; Y. S. Mor; C. W. Chen; T. M. Tsai; C. J. Chu; Fu-Ming Pan; S. M. Szea

doi:10.1149/1.1445644

Effective strategy for porous organosilicate to suppress oxygen ashing damage

Po-Tsun Liu^*, T. C. Chang, Y. S. Mor, C. W. Chen, T. M. Tsai, C. J. Chu, Fu-Ming Pan, S. M. Szea

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

25 Scopus citations

Abstract

Photoresist stripping with oxygen plasma ashing destroys numerous functional groups in porous organosilicate glasses (OSGs). This impact makes the porous OSG relatively hydrophilic and causes low-k dielectric degradation. To mitigate these issues, various strategies are investigated to enhance oxygen plasma resistance of the porous OSG. These include physical and chemical procedures. Both structural and electrical analyses are used to determine their efficiency. In addition, an optimum prescription that consists of H₂ plasma and chemical trimethylchlorosilane treatment is developed in this work. The enhancement of oxygen plasma resistance can provide the porous OSG for practical application in the multilevel interconnection.

Original language	English
Pages (from-to)	G11-G14
Journal	Electrochemical and Solid-State Letters
Volume	5
Issue number	3
DOIs	https://doi.org/10.1149/1.1445644
State	Published - Mar 2002

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@article{bab9c4b2b35e432c8953975e5c05904b,

title = "Effective strategy for porous organosilicate to suppress oxygen ashing damage",

abstract = "Photoresist stripping with oxygen plasma ashing destroys numerous functional groups in porous organosilicate glasses (OSGs). This impact makes the porous OSG relatively hydrophilic and causes low-k dielectric degradation. To mitigate these issues, various strategies are investigated to enhance oxygen plasma resistance of the porous OSG. These include physical and chemical procedures. Both structural and electrical analyses are used to determine their efficiency. In addition, an optimum prescription that consists of H2 plasma and chemical trimethylchlorosilane treatment is developed in this work. The enhancement of oxygen plasma resistance can provide the porous OSG for practical application in the multilevel interconnection.",

author = "Po-Tsun Liu and Chang, {T. C.} and Mor, {Y. S.} and Chen, {C. W.} and Tsai, {T. M.} and Chu, {C. J.} and Fu-Ming Pan and Szea, {S. M.}",

year = "2002",

month = mar,

doi = "10.1149/1.1445644",

language = "English",

volume = "5",

pages = "G11--G14",

journal = "Electrochemical and Solid-State Letters",

issn = "1099-0062",

publisher = "Electrochemical Society Inc.",

number = "3",

}

TY - JOUR

T1 - Effective strategy for porous organosilicate to suppress oxygen ashing damage

AU - Liu, Po-Tsun

AU - Chang, T. C.

AU - Mor, Y. S.

AU - Chen, C. W.

AU - Tsai, T. M.

AU - Chu, C. J.

AU - Pan, Fu-Ming

AU - Szea, S. M.

PY - 2002/3

Y1 - 2002/3

N2 - Photoresist stripping with oxygen plasma ashing destroys numerous functional groups in porous organosilicate glasses (OSGs). This impact makes the porous OSG relatively hydrophilic and causes low-k dielectric degradation. To mitigate these issues, various strategies are investigated to enhance oxygen plasma resistance of the porous OSG. These include physical and chemical procedures. Both structural and electrical analyses are used to determine their efficiency. In addition, an optimum prescription that consists of H2 plasma and chemical trimethylchlorosilane treatment is developed in this work. The enhancement of oxygen plasma resistance can provide the porous OSG for practical application in the multilevel interconnection.

AB - Photoresist stripping with oxygen plasma ashing destroys numerous functional groups in porous organosilicate glasses (OSGs). This impact makes the porous OSG relatively hydrophilic and causes low-k dielectric degradation. To mitigate these issues, various strategies are investigated to enhance oxygen plasma resistance of the porous OSG. These include physical and chemical procedures. Both structural and electrical analyses are used to determine their efficiency. In addition, an optimum prescription that consists of H2 plasma and chemical trimethylchlorosilane treatment is developed in this work. The enhancement of oxygen plasma resistance can provide the porous OSG for practical application in the multilevel interconnection.

UR - http://www.scopus.com/inward/record.url?scp=0036502773&partnerID=8YFLogxK

U2 - 10.1149/1.1445644

DO - 10.1149/1.1445644

M3 - Article

AN - SCOPUS:0036502773

SN - 1099-0062

VL - 5

SP - G11-G14

JO - Electrochemical and Solid-State Letters

JF - Electrochemical and Solid-State Letters

IS - 3

ER -

Effective strategy for porous organosilicate to suppress oxygen ashing damage

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