Keyphrases
3D IC
100%
Electromigration
100%
Joule Heating
100%
Current Crowding
100%
Mobile Technology
100%
System Level
50%
Weakest Link
50%
IC Devices
50%
Positive Feedback
25%
Two Dimensional
25%
Internet of Things
25%
Integrated Circuits
25%
Big Data Era
25%
Electronics Industry
25%
High Power
25%
Mobile Devices
25%
Gradient Force
25%
Mass Production
25%
Heat Dissipation
25%
Low Current Density
25%
Microelectronics
25%
Induced Failures
25%
Physical Size
25%
Density Region
25%
Moore's Law
25%
Heat Generation
25%
Circuit Component
25%
3D-IC Technology
25%
Link Failure
25%
Dense Packing
25%
Dense Structure
25%
Mainframe Computer
25%
Electric Potential Gradient
25%
Accelerated Systems
25%
Uncertain Reliability
25%
Software App
25%
Engineering
Electromigration
100%
Mobile Technology
100%
Resistance Heating
100%
Three Dimensional Integrated Circuits
50%
Driving Force
25%
Two Dimensional
25%
Electric Potential
25%
Electronics Industry
25%
Heat Losses
25%
Induced Failure
25%
Microelectronics
25%
Ten Year
25%
Low Current Density
25%
Physical Size
25%
Potential Gradient
25%
Field Data
25%
Moore's Law
25%
Heat Generation
25%
Integrated Circuit
25%
Big Data
25%
Internet-Of-Things
25%
Mass Production
25%