Effect of Compressive Stress on Evolution and Healing Kinetics of Artificial Voids in Highly (111)-Oriented Cu-Cu Wafer Bonding at 300 °c

Yew Chung Sermon Wu*, Meiyi Li, Tung Yen Lai, Tsan Feng Lu, Yu Hsiang Wang, Jiun Wei Chang

*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

1 Scopus citations

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Engineering & Materials Science

Chemical Compounds