TY - GEN
T1 - Effect of (111) Surface Ratio on the Bonding Quality of Cu-Cu Joints
AU - Huang, Jian Yuan
AU - Chen, Chih
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - In this study, we deposited nano-twinned Cu with various (111) ratios onto Si substrates by adjusting the electroplating parameters. Cu films with 38.7, 75.5, 94.1% of (111) surface ratio were electrodeposited. The grain sizes and surface roughness for the different specimens were controlled. To investigate the effect of the (111) ratio on Cu-to-Cu bonding, the samples were bonded at a temperature of 200 °C using a thermal compression bonding machine. The results indicate the surface (111) ratio affects the bonding strength significantly. The shear strength was 10.22 MPa, 19.08 MPa, and 23.63 MPa for the specimen with 38.7%, 75.5%, and 94.1% (111) surface ratio, respectively. Additionally, continuous voids were observed in the bonded specimen with a low (111)-oriented ratio of 38.7%. The continuous voids can be eliminated by increasing the (111)-oriented surface ratio. This research provides crucial fundamental knowledge for the effect of (111) surface percentage on the Cu-Cu bonding for 3D IC technology.
AB - In this study, we deposited nano-twinned Cu with various (111) ratios onto Si substrates by adjusting the electroplating parameters. Cu films with 38.7, 75.5, 94.1% of (111) surface ratio were electrodeposited. The grain sizes and surface roughness for the different specimens were controlled. To investigate the effect of the (111) ratio on Cu-to-Cu bonding, the samples were bonded at a temperature of 200 °C using a thermal compression bonding machine. The results indicate the surface (111) ratio affects the bonding strength significantly. The shear strength was 10.22 MPa, 19.08 MPa, and 23.63 MPa for the specimen with 38.7%, 75.5%, and 94.1% (111) surface ratio, respectively. Additionally, continuous voids were observed in the bonded specimen with a low (111)-oriented ratio of 38.7%. The continuous voids can be eliminated by increasing the (111)-oriented surface ratio. This research provides crucial fundamental knowledge for the effect of (111) surface percentage on the Cu-Cu bonding for 3D IC technology.
KW - Cu-Cu bonding
KW - Surface (111) ratio
KW - advanced packaging
KW - nanotwinned Cu
KW - shear strength
UR - http://www.scopus.com/inward/record.url?scp=85197733002&partnerID=8YFLogxK
U2 - 10.1109/ECTC51529.2024.00104
DO - 10.1109/ECTC51529.2024.00104
M3 - Conference contribution
AN - SCOPUS:85197733002
T3 - Proceedings - Electronic Components and Technology Conference
SP - 626
EP - 630
BT - Proceedings - IEEE 74th Electronic Components and Technology Conference, ECTC 2024
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 74th IEEE Electronic Components and Technology Conference, ECTC 2024
Y2 - 28 May 2024 through 31 May 2024
ER -