Editorial Introduction to the Special Issue on Electrostatic Discharge and Immunity - From IC to System

Ming Dou Ker, David Pommerenke

Research output: Contribution to journal › Editorial

Original language	English
Pages (from-to)	1783-1784
Number of pages	2
Journal	IEEE Transactions on Electromagnetic Compatibility
Volume	64
Issue number	6
DOIs	https://doi.org/10.1109/TEMC.2022.3223265
State	Published - 1 Dec 2022

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