@inproceedings{f3245a61545d47f68b273771bb39887d,
title = "Direct imprint in metal film stacks with low pressure and low temperature for optical elements applications",
abstract = "The improvements being done to the direct imprint process using a sharp mold and inserting a soft pad, which is the diluted resist between the gold film and the substrate were discussed. A silicon mold was fabricated using electron beam lithography followed by the anisotropic reactive ion etching (RIE) process. It was observed that the temperature of the direct imprint process must be maintained below the glass transition temperature of the bottom soft pad to avoid pattern distortion. To understand the influence of temperature in the direct imprint process, the film stacks were imprinted with different temperatures using a mold profile controlling.",
author = "Cheng, {H. C.} and Chuang, {S. Y.} and Chen, {H. L.} and Hung, {Y. L.} and Fu-Hsiang Ko",
year = "2004",
month = dec,
day = "1",
doi = "10.1109/IMNC.2004.245762",
language = "English",
isbn = "4990247205",
series = "Digest of Papers - Microprocesses and Nanotechnology 2004",
pages = "138--139",
booktitle = "Digest of Papers - Microprocesses and Nanotechnology 2004",
note = "2004 International Microprocesses and Nanotechnology Conference ; Conference date: 26-10-2004 Through 29-10-2004",
}