Direct copper interconnection for die/wafer bonding: Overview

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Chapter › peer-review

Original language	English
Title of host publication	Direct Copper Interconnection for Advanced Semiconductor Technology
Publisher	CRC Press
Pages	19-53
Number of pages	35
ISBN (Electronic)	9781040028643
ISBN (Print)	9781032528236
DOIs	https://doi.org/10.1201/9781003408673-2
State	Published - 28 Jun 2024

Access to Document

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title = "Direct copper interconnection for die/wafer bonding: Overview",

author = "Hung, {Tzu Heng} and Chen, {Kuan Neng}",

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AU - Chen, Kuan Neng

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