Dielectric characteristics of low-permittivity silicate using electron beam direct patterning for intermetal dielectric applications

Keyphrases

• Electron Beam 100%
• Dielectric Characteristics 100%
• Silicate 100%
• Dielectric Applications 100%
• Direct Patterning 100%
• Low Permittivity 100%
• Small Feature Size 50%
• Electron Beam Lithography 50%
• Dry Etching 50%
• Photoresist 50%
• Moisture 50%
• Etching Technology 50%
• Damascene 50%
• Material Analysis 50%
• Si-H Bonds 50%
• Hydrogen Silsesquioxane 50%
• Etch Stop Layer 50%
• Transfer Process 50%
• Pattern Transfer 50%
• Nonphotosensitive 50%

Material Science

• Permittivity 100%
• Silicate 100%
• Dielectric Material 100%
• Dry Etching 50%
• Lithography 50%
• Transfer Process 50%
• Silsesquioxane 50%