Development of low-temperature bonding platform using ultra-thin area selective deposition for heterogeneous integration

  • Mu Ping Hsu
  • , Chi Yu Chen
  • , Hsin Chi Chang
  • , Zhong Jie Hong
  • , Ming Wei Weng
  • , Kuan Neng Chen

Research output: Contribution to journalArticlepeer-review

15 Scopus citations

Fingerprint

Dive into the research topics of 'Development of low-temperature bonding platform using ultra-thin area selective deposition for heterogeneous integration'. Together they form a unique fingerprint.

Keyphrases

Engineering

Material Science