Development of low-temperature bonding platform using ultra-thin area selective deposition for heterogeneous integration

Keyphrases

• Ultrathin 100%
• Heterogeneous Integration 100%
• Area-selective 100%
• Low-temperature Bonding 100%
• Area-selective Deposition 100%
• Bonding Technology 66%
• Passivation Effect 66%
• Transmission Electron Microscope 33%
• Passivation 33%
• Cu-Cu Bonding 33%
• Transistor 33%
• Mechanical Strength 33%
• Process Optimization 33%
• Ambient Temperature 33%
• Miniaturization 33%
• Film Quality 33%
• Electron Microscopic Analysis 33%
• Bonding Mechanism 33%
• Efficient Process 33%
• Selective Passivation 33%
• Surface Exploration 33%

Engineering

• Low-Temperature 100%
• Passivation 100%
• Bonding Technology 50%
• Limitations 25%
• Film Quality 25%
• Optimized Process 25%
• Bonding Mechanism 25%

Material Science

• Film 100%
• Transistor 33%
• Electron Microscopy 33%
• Surface (Surface Science) 33%
• Strength of Materials 33%