Deep-Ultraviolet AlN Metalens with Imaging and Ultrafast Laser Microfabrication Applications

Yu Chieh Peng, Yu Jie Wang, Kuan Heng Chen, Yu Hung Lin, Haruyuki Sakurai, Hsueh Chih Chang, Cheng Ching Chiang, Ruei Tzu Duh, Bo Ray Lee, Chia Yen Huang, Min Hsiung Shih, Ray Hua Horng, Kuniaki Konishi*, Ming Lun Tseng*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

1 Scopus citations

Abstract

Deep-ultraviolet (DUV) light is essential for applications including fabrication, molecular research, and biomedical imaging. Compact metalenses have the potential to drive further innovation in these fields, provided they utilize a material platform that is cost-effective, durable, and scalable. In this work, we present aluminum nitride (AlN) metalenses as an efficient solution for DUV applications. These metalenses, with a thickness of only 380 nm, deliver DUV focusing and imaging capabilities close to the theoretical diffraction limit. Leveraging their robustness to intense ultrafast laser irradiation, we demonstrate successful DUV ultrafast laser direct writing of microstructures on a polymer film and silicon substrate. These results underscore the significant promise of advancing photonic technologies in this critical wavelength regime.

Original languageEnglish
Pages (from-to)3141-3149
Number of pages9
JournalNano letters
Volume25
Issue number8
DOIs
StatePublished - 26 Feb 2025

Keywords

  • DUV imaging
  • deep ultraviolet light
  • laser direct writing
  • metalens
  • metasurface

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