Cure analysis of sheet molding compound in molds with substructures

Jyh‐Dar ‐D Fan, L. James Lee*, Junil Kim, Yong‐Taek ‐T Im

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

12 Scopus citations

Abstract

The effects of material flow, heat transfer, part geometry, and curing agents on the cure of sheet molding compounds (SMC) in molds with substructures were analyzed both experimentally and numerically. It was found that heat transfer during mold filling has a profound effect on the cure pattern, especially for fastcure resins molded for parts with thin dimensions.

Original languageEnglish
Pages (from-to)740-748
Number of pages9
JournalPolymer Engineering & Science
Volume29
Issue number11
DOIs
StatePublished - Jun 1989

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