Correlation of electrical, thermal and structural properties of microcrystalline silicon thin films

Debajyoti Das*, Madhusudan Jana, Ashok K. Barua, Surajit Chattopadhyay, Li Chyong Chen, Kuei Hsien Chen

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

17 Scopus citations

Abstract

Thermal diffusivity (α) has been correlated with the electrical and structural properties of hydrogenated microcrystalline silicon (μc-Si:H) films. In the heterogeneous microcrystalline network, α and electrical conductivity (σD) maintain a one-to-one correspondence, and both these parameters are directly related to the crystalline volume fraction (Fc) of the network. For the amorphous silicon network, α is ∼ 0.2 cm2·s1 and has a very low σD of ∼ 10-8S·cm-1. When the crystalline volume fraction (Fc) exceeds a certain percolation threshold, both α and σD increase abruptly. Undoped μc-Si:H films having Fc ∼ 94% exhibit a high magnitude of α ∼ 0.80 cm2·s-1 and a very high σD of ∼ 10-3 S·cm-1.

Original languageEnglish
Pages (from-to)L229-L232
JournalJapanese Journal of Applied Physics, Part 2: Letters
Volume41
Issue number3 A
DOIs
StatePublished - 1 Mar 2002

Keywords

  • Crystalline volume fraction
  • Electrical conductivity
  • Microcrystalline silicon thin film
  • Thermal diffusivity

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