Conventional self-aligned MOSFET transistors with poly-silicon gate-electrode were successfully fabricated using Hf-oxide and Zr-oxide as high-k gate-dielectrics. The gate-stack consisting of poly-silicon on Hf-oxide exhibited promising transistor characteristics with a S/D RTA temperature of 1000°C, demonstrating feasibility of integrating high-k gate-dielectrics into conventional CMOS process technology. Effects of S/D RTA temperatures on the HfO2/Poly-Si transistor characteristics were discussed. A gate-dimension dependent bi-modal gate leakage current was observed from ZrO2/Poly-Si transistors.
|Number of pages
|Technical Digest - International Electron Devices Meeting
|Published - 1 Dec 2001
|IEEE International Electron Devices Meeting IEDM 2001 - Washington, DC, United States
Duration: 2 Dec 2001 → 5 Dec 2001