TY - GEN
T1 - Complementary substrate-triggered SCR devices for on-chip ESD protection circuits
AU - Ker, Ming-Dou
AU - Hsu, Kuo Chun
N1 - Publisher Copyright:
© 2002 IEEE.
PY - 2002
Y1 - 2002
N2 - The turn-on mechanism of SCR device is essentially a current triggering event. While a current is applied to the base or substrate of a SCR device, it can be quickly triggered on into its latching state. In this paper, the complementary substrate-triggered SCR devices, which are combined with the substrate-triggered technique and SCR devices, are first reported in the literature for using in the on-chip ESD protection circuits. A complementary style on the substrate-triggered SCR devices is designed to discharge both of the positive and negative ESD stresses on the pad. The total holding voltage of the substrate-triggered SCR device can be increased by adding the stacked diode string to avoid the transient-induced latchup issue in the ESD protection circuits. The on-chip ESD protection circuits designed with the proposed complementary substrate-triggered SCR devices for the I/O pad and power pad have been successfully verified in a 0.25-μm STI CMOS process with the HBM (MM) ESD level of >8kV (650V) in a small layout area.
AB - The turn-on mechanism of SCR device is essentially a current triggering event. While a current is applied to the base or substrate of a SCR device, it can be quickly triggered on into its latching state. In this paper, the complementary substrate-triggered SCR devices, which are combined with the substrate-triggered technique and SCR devices, are first reported in the literature for using in the on-chip ESD protection circuits. A complementary style on the substrate-triggered SCR devices is designed to discharge both of the positive and negative ESD stresses on the pad. The total holding voltage of the substrate-triggered SCR device can be increased by adding the stacked diode string to avoid the transient-induced latchup issue in the ESD protection circuits. The on-chip ESD protection circuits designed with the proposed complementary substrate-triggered SCR devices for the I/O pad and power pad have been successfully verified in a 0.25-μm STI CMOS process with the HBM (MM) ESD level of >8kV (650V) in a small layout area.
UR - http://www.scopus.com/inward/record.url?scp=79956346072&partnerID=8YFLogxK
U2 - 10.1109/ASIC.2002.1158061
DO - 10.1109/ASIC.2002.1158061
M3 - Conference contribution
AN - SCOPUS:79956346072
T3 - Proceedings of the Annual IEEE International ASIC Conference and Exhibit
SP - 229
EP - 233
BT - Proceedings - 15th Annual IEEE International ASIC/SOC Conference, ASIC/SOC 2002
A2 - Chickanosky, John
A2 - Krishnamurthy, Ram K.
A2 - Mukund, P.R.
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 15th Annual IEEE International ASIC/SOC Conference, ASIC/SOC 2002
Y2 - 25 September 2002 through 28 September 2002
ER -