Boron was implanted into p-type (100) silicon at an energy of 4 MeV to create a layer of heavily doped silicon centered at a depth of 5.2 μm below the surface. Both n-channel and p-channel metal-oxide-silicon, field-effect transistors (MOSFET's) and various diode structures were fabricated over this implanted region by using a 3-μm complementary MOSFET (CMOS) technology. The results show that the implanted silicon is recrystallized to a device quality state. No increase in diode leakage or degradation in MOSFET device characteristics is observed. Experimental results show that this subdevice buried layer leads to a reduction of CMOS latch-up susceptibility.