Comparisons of Performance and Reliability in 4H-SiC Tri-gate and Planar MOSFETs

Jia Wei Hu*, Tsung Yuan Lu, Kuan Min Kang, Chih Fang Huang, Bang Ren Chen, Tian Li Wu

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In this work, a low-voltage tri-gate MOSFET in 4H-SiC is fabricated and measured to compare its performance with a planar gate MOSFET with the same channel length. The preliminary reliability of the devices is also studied. Experimental results show that the larger effective channel width enhances the current of the tri-gate contributed from the trench sidewall and the higher electron channel mobility on the a-face of 4H-SiC pm the sidewall, even though the gate voltage is limited at a lower value. PBTI, NBTI, and dynamic Ron are also measured and the results show that the reliability of both devices are comparable.

Original languageEnglish
Title of host publicationWiPDA Asia 2023 - IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798350337112
DOIs
StatePublished - 2023
Event2023 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia, WiPDA Asia 2023 - Hsinchu, Taiwan
Duration: 27 Aug 202329 Aug 2023

Publication series

NameWiPDA Asia 2023 - IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia

Conference

Conference2023 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia, WiPDA Asia 2023
Country/TerritoryTaiwan
CityHsinchu
Period27/08/2329/08/23

Keywords

  • 4H-SiC
  • bias-temperature stress
  • MOSFET
  • reliability
  • tri-gate

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