Color quality improvement of micro LED display image by TMP LED design

Hsiao Wen Lee; Ting Jay Wang; Bor-Shyh Lin

doi:10.1109/ACCESS.2018.2880090

Color quality improvement of micro LED display image by TMP LED design

Hsiao Wen Lee, Ting Jay Wang, Bor-Shyh Lin^*

^*Corresponding author for this work

Institute of Imaging and Biomedical Photonics

Research output: Contribution to journal › Article › peer-review

5 Scopus citations

Abstract

In recent years, Micro LED technology has been popularly developed. How to improve the issue of color stability in Micro LED technology is an important and also a difficult research topic. Here, the brightness decay and color displacement in high chip temperature are the two major factors in the color quality of Micro LED display image. In this paper, the technique of thin metal package is applied in the LED package to effectively improve the material thermal resistance of the LED package. By improving the material thermal resistance of the LED package, it could improve the brightness decay 5% in LED high junction temperature. The proposed method could reduce 0.01 of Cx displacement in LED high junction temperature and control Cy displacement less than 0.005 in chip junction temperature 45° to 110°. From the experimental results, the proposed method could exactly improve the color quality of quantum well Micro LED display image in high temperature.

Original language	English
Article number	8532353
Pages (from-to)	70122-70129
Number of pages	8
Journal	IEEE Access
Volume	6
DOIs	https://doi.org/10.1109/ACCESS.2018.2880090
State	Published - 12 Nov 2018

Keywords

electronic packaging thermal
thermal management of electronics
Thin film devices

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10.1109/ACCESS.2018.2880090

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title = "Color quality improvement of micro LED display image by TMP LED design",

abstract = "In recent years, Micro LED technology has been popularly developed. How to improve the issue of color stability in Micro LED technology is an important and also a difficult research topic. Here, the brightness decay and color displacement in high chip temperature are the two major factors in the color quality of Micro LED display image. In this paper, the technique of thin metal package is applied in the LED package to effectively improve the material thermal resistance of the LED package. By improving the material thermal resistance of the LED package, it could improve the brightness decay 5% in LED high junction temperature. The proposed method could reduce 0.01 of Cx displacement in LED high junction temperature and control Cy displacement less than 0.005 in chip junction temperature 45° to 110°. From the experimental results, the proposed method could exactly improve the color quality of quantum well Micro LED display image in high temperature.",

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author = "Lee, {Hsiao Wen} and Wang, {Ting Jay} and Bor-Shyh Lin",

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T1 - Color quality improvement of micro LED display image by TMP LED design

AU - Lee, Hsiao Wen

AU - Wang, Ting Jay

AU - Lin, Bor-Shyh

PY - 2018/11/12

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N2 - In recent years, Micro LED technology has been popularly developed. How to improve the issue of color stability in Micro LED technology is an important and also a difficult research topic. Here, the brightness decay and color displacement in high chip temperature are the two major factors in the color quality of Micro LED display image. In this paper, the technique of thin metal package is applied in the LED package to effectively improve the material thermal resistance of the LED package. By improving the material thermal resistance of the LED package, it could improve the brightness decay 5% in LED high junction temperature. The proposed method could reduce 0.01 of Cx displacement in LED high junction temperature and control Cy displacement less than 0.005 in chip junction temperature 45° to 110°. From the experimental results, the proposed method could exactly improve the color quality of quantum well Micro LED display image in high temperature.

AB - In recent years, Micro LED technology has been popularly developed. How to improve the issue of color stability in Micro LED technology is an important and also a difficult research topic. Here, the brightness decay and color displacement in high chip temperature are the two major factors in the color quality of Micro LED display image. In this paper, the technique of thin metal package is applied in the LED package to effectively improve the material thermal resistance of the LED package. By improving the material thermal resistance of the LED package, it could improve the brightness decay 5% in LED high junction temperature. The proposed method could reduce 0.01 of Cx displacement in LED high junction temperature and control Cy displacement less than 0.005 in chip junction temperature 45° to 110°. From the experimental results, the proposed method could exactly improve the color quality of quantum well Micro LED display image in high temperature.

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KW - Thin film devices

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Color quality improvement of micro LED display image by TMP LED design

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Keywords

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