Co-sputtered Ru-Ti alloy electrodes for DRAM applications

Keyphrases

• Resistivity 100%
• Alloy Films 100%
• Co-sputtering 100%
• Alloy Electrode 100%
• Ti Alloy 100%
• Si Substrate 50%
• Thermal Stability 50%
• Oxides 50%
• Rapid Thermal Processing 50%
• Bottom Electrode 50%
• As-deposited 50%
• High Thermal Stability 50%
• As-deposited Films 50%
• Thermally Stable 50%
• X-ray Diffraction Measurement 50%
• Interdiffusion 50%
• Structure Formation 50%
• Metal Film 50%
• Conductive Behavior 50%
• Paraelectric 50%
• Alloy Thin Films 50%
• Film Capacitor 50%
• Ru Metal 50%
• Resistivity Structure 50%
• Thermal Barrier 50%
• Formation Stability 50%
• Ru Atoms 50%
• Alloy Substrate 50%

Material Science

• Electrical Resistivity 100%
• Film 100%
• Thin Films 66%
• Thermal Stability 66%
• Phase Composition 66%
• Ferroelectric Material 33%
• Diffraction Measurement 33%
• X-Ray Diffraction 33%
• Oxide Compound 33%
• Oxidation Reaction 33%
• Capacitor 33%
• Metal Film 33%
• Surface (Surface Science) 33%

Engineering

• Thin Films 100%
• Phase Composition 100%
• Ray Diffraction 50%
• Si Substrate 50%
• Conductive 50%
• Deposited Film 50%
• Rapid Thermal Processing 50%
• Interdiffusion 50%