CMP of ultra low-k material porous-polysilazane (PPSZ) for interconnect applications

T. C. Chang*, T. M. Tsai, Po-Tsun Liu, C. W. Chen, S. T. Yan, H. Aoki, Y. C. Chang, Tseung-Yuen Tseng

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

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