CIMR-V: An End-to-End SRAM-based CIM Accelerator with RISC-V for AI Edge Device

Yan Cheng Guo*, Tian Sheuan Chang, Chih Sheng Lin, Bo Cheng Chiou, Chih Ming Lai, Shyh Shyuan Sheu, Wei Chung Lo, Shih Chieh Chang

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Computing-in-memory (CIM) is renowned in deep learning due to its high energy efficiency resulting from highly parallel computing with minimal data movement. However, current SRAM-based CIM designs suffer from long latency for loading weight or feature maps from DRAM for large AI models. Moreover, previous SRAM-based CIM architectures lack end-to-end model inference. To address these issues, this paper proposes CIMR-V, an end-to-end CIM accelerator with RISC-V that incorporates CIM layer fusion, convolution/max pooling pipeline, and weight fusion, resulting in an 85.14% reduction in latency for the keyword spotting model. Furthermore, the proposed CIM-type instructions facilitate end-to-end AI model inference and full stack flow, effectively synergizing the high energy efficiency of CIM and the high programmability of RISC-V. Implemented using TSMC 28nm technology, the proposed design achieves an energy efficiency of 3707.84 TOPS/W and 26.21 TOPS at 50 MHz.

Original languageEnglish
Title of host publicationISCAS 2024 - IEEE International Symposium on Circuits and Systems
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798350330991
DOIs
StatePublished - 2024
Event2024 IEEE International Symposium on Circuits and Systems, ISCAS 2024 - Singapore, Singapore
Duration: 19 May 202422 May 2024

Publication series

NameProceedings - IEEE International Symposium on Circuits and Systems
ISSN (Print)0271-4310

Conference

Conference2024 IEEE International Symposium on Circuits and Systems, ISCAS 2024
Country/TerritorySingapore
CitySingapore
Period19/05/2422/05/24

Keywords

  • AI accelerator
  • Computing-in-memory
  • Pruning framework

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