Chip-level and board-level CDM ESD tests on IC products

Ming-Dou Ker*, Chih Kuo Huang, Yuan Wen Hsiao, Yong Fen Hsieh

*Corresponding author for this work

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    1 Scopus citations

    Abstract

    The electrostatic discharge (ESD) transient currents and failure analysis (FA) between chip-level and board-level charged-device-model (CDM) ESD tests are investigated in this work. The discharging current waveforms of three different printed circuit boards (PCBs) are characterized first. Then, the chip-level and board-level CDM ESD tests are performed to an ESD-protected dummy NMOS and a high-speed receiver front-end circuit, respectively. Scanning electron microscope (SEM) failure pictures show that the board-level CDM ESD test causes much severer failure than that caused by the chip-level CDM ESD test.

    Original languageEnglish
    Title of host publicationProceedings of the 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2009
    Pages45-49
    Number of pages5
    DOIs
    StatePublished - 16 Nov 2009
    Event2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2009 - Suzhou, China
    Duration: 6 Jul 200910 Jul 2009

    Publication series

    NameProceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

    Conference

    Conference2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2009
    Country/TerritoryChina
    CitySuzhou
    Period6/07/0910/07/09

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