Characterization of Slow Traps in SiGe MOS Interfaces by TiN/Y2O3 Gate Stacks

T. E. Lee*, K. Toprasertpong, M. Takenaka, S. Takagi

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

Abstract

We have examined the slow electron and hole trap density at TiN/Y2O3/SiGe MOS interfaces. The effect of trimethylaluminum (TMA) pre-treatment before Y2O3 deposition on the slow trap density has been studied. Also, the dependency of the slow trap density on Ge contents of SiGe has been systematically evaluated and the influence of the composition of interfacial layers (ILs) is examined. It is found that 10-cycle TMA treatment is effective to suppress the formation of slow traps attributable to Ge-O bonds in ILs. On the other hand, the density of electron and hole slow traps in the Y2O3/SiGe MOS interfaces increases with higher Ge content of SiGe, which can be explained by the formation of vacancy-related defects due to incorporation of Ge-O bonds into SiO2 IL networks.

Original languageEnglish
Title of host publication2021 IEEE International Reliability Physics Symposium, IRPS 2021 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728168937
DOIs
StatePublished - Mar 2021
Event2021 IEEE International Reliability Physics Symposium, IRPS 2021 - Virtual, Monterey, United States
Duration: 21 Mar 202124 Mar 2021

Publication series

NameIEEE International Reliability Physics Symposium Proceedings
Volume2021-March
ISSN (Print)1541-7026

Conference

Conference2021 IEEE International Reliability Physics Symposium, IRPS 2021
Country/TerritoryUnited States
CityVirtual, Monterey
Period21/03/2124/03/21

Keywords

  • MOS interfaces
  • reliability
  • SiGe
  • slow trap density

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