CDM ESD protection design with initial-on concept in nanoscale CMOS process

Chun Yu Lin*, Ming-Dou Ker

*Corresponding author for this work

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    8 Scopus citations

    Abstract

    Integrated circuits (ICs) have been fabricated with thinner gate oxides to achieve higher speed and lower power consumption in nanoscale CMOS processes. However, the charged-device-model (CDM) electrostatic discharge (ESD) events became more critical because of the thinner gate oxide in nanoscale CMOS transistors and the larger die size for the system-on-chip (SoC) applications. Thus, effective on-chip ESD protection design against CDM ESD stresses has become more challenging to be implemented. A novel on-chip ESD protection design against CDM ESD events was proposed in this work, and its performance has been verified by the silicon chip fabricated in 55-nm CMOS process.

    Original languageEnglish
    Title of host publicationIPFA 2010 - 17th International Symposium on the Physical and Failure Analysis of Integrated Circuits
    DOIs
    StatePublished - 15 Sep 2010
    Event17th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2010 - Singapore, Singapore
    Duration: 5 Jul 20109 Jul 2010

    Publication series

    NameProceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

    Conference

    Conference17th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2010
    Country/TerritorySingapore
    CitySingapore
    Period5/07/109/07/10

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