Built-in self-test/repair methodology for multiband RF-Interconnected TSV 3D integration

Shu Feng Cheng; Po Tsang Huang; Li Chun Wang; Mau Chung Frank Chang

doi:10.1109/MDAT.2019.2932935

Built-in self-test/repair methodology for multiband RF-Interconnected TSV 3D integration

Shu Feng Cheng, Po Tsang Huang, Li Chun Wang^*, Mau Chung Frank Chang

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

4 Scopus citations

Abstract

Editor's note: Multiband radio-frequency interconnect (MRFI) is an emerging technology to achieve low-latency and energy-efficient on-chip communication. This article proposes a BIST method to improve the reliability of MRFI-based design. -Partha Pratim Pande, Washington State University.

Original language	English
Article number	8786260
Pages (from-to)	63-71
Number of pages	9
Journal	IEEE Design and Test
Volume	36
Issue number	6
DOIs	https://doi.org/10.1109/MDAT.2019.2932935
State	Published - Dec 2019

Keywords

BIST/R
e-fuse
multiband RF-Interconnect
phase error
PRBS
test methodology
TSV density
yield improvement

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10.1109/MDAT.2019.2932935

Cite this

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title = "Built-in self-test/repair methodology for multiband RF-Interconnected TSV 3D integration",

abstract = "Editor's note: Multiband radio-frequency interconnect (MRFI) is an emerging technology to achieve low-latency and energy-efficient on-chip communication. This article proposes a BIST method to improve the reliability of MRFI-based design. -Partha Pratim Pande, Washington State University.",

keywords = "BIST/R, e-fuse, multiband RF-Interconnect, phase error, PRBS, test methodology, TSV density, yield improvement",

author = "Cheng, {Shu Feng} and Huang, {Po Tsang} and Wang, {Li Chun} and Chang, {Mau Chung Frank}",

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AU - Chang, Mau Chung Frank

PY - 2019/12

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AB - Editor's note: Multiband radio-frequency interconnect (MRFI) is an emerging technology to achieve low-latency and energy-efficient on-chip communication. This article proposes a BIST method to improve the reliability of MRFI-based design. -Partha Pratim Pande, Washington State University.

KW - BIST/R

KW - e-fuse

KW - multiband RF-Interconnect

KW - phase error

KW - PRBS

KW - test methodology

KW - TSV density

KW - yield improvement

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Built-in self-test/repair methodology for multiband RF-Interconnected TSV 3D integration

Abstract

Keywords

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