Abstract
BSIMPD- a physics-based SPICE model is developed for bridging deep-submicron CMOS designs using partially-depleted SOI technologies. Formulated on top of the industry-standard bulk-MOSFET model BSIM3v3 for a sound base of scalability and robustness, BSIMPD captures SOI-specific dynamic behaviors with its built-in floating-body, self-heating and body-contact models. A parameter-extraction strategy is demonstrated, and the simulation efficiency is studied. The model has been tested extensively within IBM on state-of-the-art high speed SOI technologies. It has been implemented in many circuit simulators.
| Original language | English |
|---|---|
| Pages (from-to) | 197-200 |
| Number of pages | 4 |
| Journal | Proceedings of the Custom Integrated Circuits Conference |
| DOIs | |
| State | Published - 2000 |
| Event | CICC 2000: 22nd Annual Custom Integrated Circuits Conference - Orlando, FL, USA Duration: 21 May 2000 → 24 May 2000 |