Bonding Mechanisms of Roughened Nanotwinned-Cu Surface at Temperature as Low as 120 C

Yewchung Sermon Wu; Tung Yen Lai; Meiyi Li; Tsan Feng Lu; Yu Hsiang Wang; Tzu Yen Tseng

doi:10.1149/2162-8777/abd261

Bonding Mechanisms of Roughened Nanotwinned-Cu Surface at Temperature as Low as 120 C

Yewchung Sermon Wu, Tung Yen Lai, Meiyi Li, Tsan Feng Lu, Yu Hsiang Wang, Tzu Yen Tseng

Research output: Contribution to journal › Article › peer-review

17 Scopus citations

Abstract

Cu direct bonding has been achieved at 150 C by using (111)-oriented nanotwinned Cu (nt-Cu) because it has the fastest surface diffusivity. In this study, nt-Cu was bonded at even lower temperature of 120 C by roughening one of the nt-Cu surfaces. However, the flat-to-flat nt-Cu could not be bonded at the same temperature. This result violates a bonding concept that "for good wafer bonding, the contact area must be as large as possible". This paper discusses in detail two possible bonding mechanisms: diffusion and creep/plastic deformation.

Original language	English
Article number	124005
Journal	ECS Journal of Solid State Science and Technology
Volume	9
Issue number	12
DOIs	https://doi.org/10.1149/2162-8777/abd261
State	Published - Dec 2020

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title = "Bonding Mechanisms of Roughened Nanotwinned-Cu Surface at Temperature as Low as 120 C",

abstract = "Cu direct bonding has been achieved at 150 C by using (111)-oriented nanotwinned Cu (nt-Cu) because it has the fastest surface diffusivity. In this study, nt-Cu was bonded at even lower temperature of 120 C by roughening one of the nt-Cu surfaces. However, the flat-to-flat nt-Cu could not be bonded at the same temperature. This result violates a bonding concept that {"}for good wafer bonding, the contact area must be as large as possible{"}. This paper discusses in detail two possible bonding mechanisms: diffusion and creep/plastic deformation.",

author = "Wu, {Yewchung Sermon} and Lai, {Tung Yen} and Meiyi Li and Lu, {Tsan Feng} and Wang, {Yu Hsiang} and Tseng, {Tzu Yen}",

note = "Publisher Copyright: {\textcopyright} 2020 The Electrochemical Society ({"}ECS{"}). Published on behalf of ECS by IOP Publishing Limited.",

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month = dec,

doi = "10.1149/2162-8777/abd261",

language = "English",

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T1 - Bonding Mechanisms of Roughened Nanotwinned-Cu Surface at Temperature as Low as 120 C

AU - Wu, Yewchung Sermon

AU - Lai, Tung Yen

AU - Li, Meiyi

AU - Lu, Tsan Feng

AU - Wang, Yu Hsiang

AU - Tseng, Tzu Yen

PY - 2020/12

Y1 - 2020/12

N2 - Cu direct bonding has been achieved at 150 C by using (111)-oriented nanotwinned Cu (nt-Cu) because it has the fastest surface diffusivity. In this study, nt-Cu was bonded at even lower temperature of 120 C by roughening one of the nt-Cu surfaces. However, the flat-to-flat nt-Cu could not be bonded at the same temperature. This result violates a bonding concept that "for good wafer bonding, the contact area must be as large as possible". This paper discusses in detail two possible bonding mechanisms: diffusion and creep/plastic deformation.

AB - Cu direct bonding has been achieved at 150 C by using (111)-oriented nanotwinned Cu (nt-Cu) because it has the fastest surface diffusivity. In this study, nt-Cu was bonded at even lower temperature of 120 C by roughening one of the nt-Cu surfaces. However, the flat-to-flat nt-Cu could not be bonded at the same temperature. This result violates a bonding concept that "for good wafer bonding, the contact area must be as large as possible". This paper discusses in detail two possible bonding mechanisms: diffusion and creep/plastic deformation.

UR - http://www.scopus.com/inward/record.url?scp=85098272276&partnerID=8YFLogxK

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DO - 10.1149/2162-8777/abd261

M3 - Article

AN - SCOPUS:85098272276

SN - 2162-8769

VL - 9

JO - ECS Journal of Solid State Science and Technology

JF - ECS Journal of Solid State Science and Technology

IS - 12

M1 - 124005

ER -

Bonding Mechanisms of Roughened Nanotwinned-Cu Surface at Temperature as Low as 120 C

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