Bonding Mechanisms of Roughened Nanotwinned-Cu Surface at Temperature as Low as 120 C

Yewchung Sermon Wu, Tung Yen Lai, Meiyi Li, Tsan Feng Lu, Yu Hsiang Wang, Tzu Yen Tseng

Research output: Contribution to journalArticlepeer-review

7 Scopus citations

Abstract

Cu direct bonding has been achieved at 150 C by using (111)-oriented nanotwinned Cu (nt-Cu) because it has the fastest surface diffusivity. In this study, nt-Cu was bonded at even lower temperature of 120 C by roughening one of the nt-Cu surfaces. However, the flat-to-flat nt-Cu could not be bonded at the same temperature. This result violates a bonding concept that "for good wafer bonding, the contact area must be as large as possible". This paper discusses in detail two possible bonding mechanisms: diffusion and creep/plastic deformation.

Original languageEnglish
Article number124005
JournalECS Journal of Solid State Science and Technology
Volume9
Issue number12
DOIs
StatePublished - Dec 2020

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