Bond-and-transfer scanning probe array for high-density data storage

Chien-Wen Hsieh*, Ching Hsiang Tsai, We Chih Lin, Chao Chiun Liang, Yu Wen Lee

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

9 Scopus citations


This paper reports a study of a wafer-level bond-and-transfer technique for scanning probe arrays and its future application on probe-based data storage. The bonding performance between sodium ion-rich glass and silicon-nitride- deposited silicon substrate has been characterized. The effects of tool pressure, bonding time, surface properties, and cleanliness were thoroughly discussed. Furthermore, the silicon-nitride-based scanning probe array with pyramidal tip and 1.5-μm-thick cantilevers were successful bonded and transferred to Pyrex 7740 substrate by the optimized condition of wafer-scale electrostatic force bonding and transferring processes. The nano-patterning capabilities of scanning probe array for high-density data storage were also discussed.

Original languageEnglish
Pages (from-to)989-991
Number of pages3
JournalIEEE Transactions on Magnetics
Issue number2
StatePublished - 1 Feb 2005


  • Data storage
  • Electrostatic force bonding
  • Scanning probe array


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