Board-level ESD of driver ICs on LCD panel

Jen Chou Tseng*, Chung Ti Hsu, Chia Ku Tsai, Shu Chuan Chen, Ming-Dou Ker

*Corresponding author for this work

    Research output: Contribution to journalArticlepeer-review

    9 Scopus citations


    In this paper, a method utilizing a charged-device model (CDM) test by the tape carrier package or chip-on-film (COF) samples to emulate the real-world board-level CDM or charged-board model (CBM) electrostatic discharge is proposed for large-sized chips such as liquid-crystal display (LCD) driver ICs, which successfully duplicated the same failure by CBM discharging. For small-sized chips, the evaluation board (or printed circuit board) emulation should minimize the parasitic RLC loading of the interconnection on the board to achieve a more accurate CBM discharging. In addition, guidelines regarding chip-level design and layout optimization are proposed and have been successfully implemented to improve the immunity.

    Original languageEnglish
    Article number4796376
    Pages (from-to)59-64
    Number of pages6
    JournalIEEE Transactions on Device and Materials Reliability
    Issue number1
    StatePublished - 2009


    • Charged-board model (CBM)
    • Electrostatic discharge (ESD)


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