Asymmetric low temperature cu-polymer hybrid bonding with Au passivation layer

Ming Wei Weng, Shan Yu Mao, Demin Liu, Han Wen Hu, Kuan Neng Chen*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

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Keyphrases

Engineering

Material Science