Abstract
We have fabricated the TaN-[SiO2-LaAlO3]- HfONLaAlO3-SiO2 Si charge-trapping Flash device. A large 6.4-V initial memory window, a 4.3-V 10-year extrapolated retention window at 125 °C, and a 5.5-V endurance window at 10-6 cycles were measured under very fast 100- μs and low 16-V program/erase. These excellent results were achieved using an As+ implant into the HfON trapping layer, which were significantly better than those of the control device without ion implantation.
Original language | English |
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Article number | 5699333 |
Pages (from-to) | 381-383 |
Number of pages | 3 |
Journal | Ieee Electron Device Letters |
Volume | 32 |
Issue number | 3 |
DOIs | |
State | Published - Mar 2011 |
Keywords
- Charge-trapping Flash (CTF)
- HfON
- ion implant
- nonvolatile memory (NVM)