Abstract
A novel hexagon-type layout is proposed to realize large-dimension CMOS output transistors with smaller layout area but higher ESD reliability. The drain parasitic capacitance of hexagon-type layout is also smaller than that of traditional finger-type layout. Experimental results have shown that the maximum driving capability per layout area of output transistor with hexagon-type layout is improved 40% more than that with finger-type layout. This hexagon-type layout is very suitable for deep-submicron low-voltage CMOS IC's in high-density applications.
Original language | English |
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Pages | 94-96 |
Number of pages | 3 |
DOIs | |
State | Published - 1996 |
Event | Proceedings of the 1996 3rd IEEE Hong Kong Electron Devices Meeting - Hong Kong, Hong Kong Duration: 29 Jun 1996 → 29 Jun 1996 |
Conference
Conference | Proceedings of the 1996 3rd IEEE Hong Kong Electron Devices Meeting |
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City | Hong Kong, Hong Kong |
Period | 29/06/96 → 29/06/96 |