Antibacterial properties of TaN-(Ag,Cu) nanocomposite thin films

J. H. Hsieh*, T. H. Yeh, C. Li, C. H. Chiu, C. T. Huang

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

38 Scopus citations


TaN-(Ag,Cu) nanocomposite films were deposited by reactive co-sputtering on Si(001). The films were then annealed using RTA (Rapid Thermal Annealing) at 200-400 °C to induce the nucleation and growth of metal particles in TaN matrix and on film surface. After the surface morphologies were analyzed, the samples were tested for their antibacterial behaviors against Gram-negative (Escherichia coli) and Gram-positive (Staphylococcus aureus) bacteria. It is found that the antibacterial efficiency against either E. coli or S. aureus can be much improved for TaN-(Ag,Cu), comparing with TaN-Ag or TaN-Cu films. The annealing temperature for TaN-(Ag,Cu) can be as low as 250 °C. Being annealed at this temperature, the film still shows good antibacterial behaviors against either bacterium. The synergistic effect due to the co-existence of Ag and Cu is obvious, while the films still shows good tribological behaviors.

Original languageEnglish
Pages (from-to)160-163
Number of pages4
StatePublished - 2013


  • Antibacterial properties
  • Co-sputtering
  • Nanocomposite thin films
  • TaN-(Ag Cu)


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