Analysis of Si/SiGe channel pMOSFETs for deep-submicron scaling

Short-channel effects of Si _1-xGe _x p-channel MOSFETs have been examined by two-dimensional computer simulation. It is found that devices incorporating SiGe channel offer worthwhile advantages in device performance and scalability. In addition to enhanced drive current due to higher hole mobility, Si _1-xGe _x p-channel MOSFETs also provide better carrier confinement in the Si/SiGe quantum well, which leads to lower gate-controlled depletion charge and electric field in the subsurface. These in turn suppress the drain-induced barrier lowering and punch through effects in SiGe pMOSFETs compared to the bulk Si devices at the same physical dimension. Higher device performance and better scalability make Si _1-xGe _x p-channel MOSFETs a great benefit for high-speed and low-power CMOS circuit applications.