Abstract
Crosstalk in a packaged multi-circuit system is simulated by applying the FDTD method using large-signal analysis. The capability of full-wave simulation is obtained by appropriate modeling of the device-wave interaction. Crosstalk of different input-power levels, thus, is examined by checking the output power.
| Original language | English |
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| Pages | 193-195 |
| Number of pages | 3 |
| State | Published - 1 Dec 1996 |
| Event | Proceedings of the 1996 5th Topical Meeting on Electrical Performance of Electronic Packaging - Napa Valley, CA, USA Duration: 28 Oct 1996 → 30 Oct 1996 |
Conference
| Conference | Proceedings of the 1996 5th Topical Meeting on Electrical Performance of Electronic Packaging |
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| City | Napa Valley, CA, USA |
| Period | 28/10/96 → 30/10/96 |