@inproceedings{b5dedc1e0d1a488fa7e6c1302042adb7,
title = "Analysis of abnormal ESD failure mechanism in high-pin-count BGA packaged ICs due to stressing non-connected balls",
abstract = "An abnormal failure mechanism due to ESD stressing on the Non-Connected (NC) balls of a high-pin-count (>500 balls) BGA packaged IC is presented. Failure analyses including Scanning Electronic Microscopy (SEM) photographs and the measurement of current waveform during ESD zapping had been performed to give clear explanation on this unusual phenomenon. New protection solutions have been proposed to solve this problem in a BGA packaged IC product with an improvement ESD robustness, which can sustain 3-kV HBM and 300-V MM ESD stresses.",
author = "Lo, {Wen Yu} and Ming-Dou Ker",
year = "2003",
month = jan,
day = "1",
doi = "10.1109/IPFA.2003.1222760",
language = "English",
series = "Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "174--178",
editor = "Philip Ho and Daniel Chan and Alastair Trigg and John Thong",
booktitle = "Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2003",
address = "美國",
note = "10th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2003 ; Conference date: 11-07-2003",
}