Abstract
An abnormal failure mechanism due to ESD zapping on the Non-Connected (NC) balls of a 683-pin BGA packaged chipset IC is presented. Failure analyses, including Scanning Electronic Microscopy (SEM) photographs and the measurement of current waveforms during ESD zapping, had been performed with a new proposed equivalent circuit to give clear explanation on this unusual phenomenon. Several methods to prevent such failure mechanism are also discussed.
Original language | English |
---|---|
Pages (from-to) | 1583-1588 |
Number of pages | 6 |
Journal | Microelectronics Reliability |
Volume | 43 |
Issue number | 9-11 |
DOIs | |
State | Published - Sep 2003 |
Event | 14th European Symposium on Reliability of Electron Devices, Fa - Bordeaux, France, France Duration: 7 Oct 2003 → 10 Oct 2003 |