An abnormal failure mechanism due to ESD zapping on the Non-Connected (NC) balls of a 683-pin BGA packaged chipset IC is presented. Failure analyses, including Scanning Electronic Microscopy (SEM) photographs and the measurement of current waveforms during ESD zapping, had been performed with a new proposed equivalent circuit to give clear explanation on this unusual phenomenon. Several methods to prevent such failure mechanism are also discussed.
|Number of pages||6|
|State||Published - 1 Sep 2003|
|Event||14th European Symposium on Reliability of Electron Devices, Fa - Bordeaux, France, France|
Duration: 7 Oct 2003 → 10 Oct 2003