Analysis and Prevention on NC-ball induced ESD Damages in a 683-Pin BGA Packaged Chipset IC

Wen Yu Lo*, Ming-Dou Ker

*Corresponding author for this work

    Research output: Contribution to journalConference articlepeer-review

    1 Scopus citations

    Abstract

    An abnormal failure mechanism due to ESD zapping on the Non-Connected (NC) balls of a 683-pin BGA packaged chipset IC is presented. Failure analyses, including Scanning Electronic Microscopy (SEM) photographs and the measurement of current waveforms during ESD zapping, had been performed with a new proposed equivalent circuit to give clear explanation on this unusual phenomenon. Several methods to prevent such failure mechanism are also discussed.

    Original languageEnglish
    Pages (from-to)1583-1588
    Number of pages6
    JournalMicroelectronics Reliability
    Volume43
    Issue number9-11
    DOIs
    StatePublished - Sep 2003
    Event14th European Symposium on Reliability of Electron Devices, Fa - Bordeaux, France, France
    Duration: 7 Oct 200310 Oct 2003

    Fingerprint

    Dive into the research topics of 'Analysis and Prevention on NC-ball induced ESD Damages in a 683-Pin BGA Packaged Chipset IC'. Together they form a unique fingerprint.

    Cite this