An ultra-high-density 256-channel/25mm2 neural sensing microsystem using TSV-embedded neural probes

Yu Chieh Huang; Po-Tsang Huang; Shang Lin Wu; Yu Chen Hu; Yan Huei You; Ming Chen; Yan Yu Huang; Hsiao Chun Chang; Yen Han Lin; Jeng-Ren Duann; Tzai-Wen Chiu; Wei Hwang; Kuan-Neng Chen; Ching-Te Chuang; Jin-Chern Chiou

doi:10.1109/ISCAS.2016.7527487

An ultra-high-density 256-channel/25mm2 neural sensing microsystem using TSV-embedded neural probes

Yu Chieh Huang, Po-Tsang Huang, Shang Lin Wu, Yu Chen Hu, Yan Huei You, Ming Chen, Yan Yu Huang, Hsiao Chun Chang, Yen Han Lin, Jeng-Ren Duann, Tzai-Wen Chiu, Wei Hwang, Kuan-Neng Chen, Ching-Te Chuang, Jin-Chern Chiou

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

5 Scopus citations

Abstract

Highly integrated neural sensing microsystems are crucial to capture accurate signals for brain function investigations. In this paper, a 256-channel/25 mm2 neural sensing microsystem is presented based on through-silicon-via (TSV) 2.5D integration. This microsystem composes of dissolvable μ-needles, TSV-embedded μ-probes, 256-channel neural amplifiers, 11-bit area-power-efficient SAR ADCs and serializers. Based on the dissolvable μ-needles and TSV 2.5D integration, this microsystem can detect 256 ECoG/LFP signals within the small area of 5mm × 5mm. Additionally, the neural amplifier realizes 57.8dB gain with only 9.8μW for each channel, and the 9.7-bit ENOB of the SAR ADC at 32kS/s can be achieved with 0.42μW and 0.036 mm2. The overall power of this microsystem is only 3.79mW for 256-channel neural sensing.

Original language	English
Title of host publication	ISCAS 2016 - IEEE International Symposium on Circuits and Systems
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1302-1305
Number of pages	4
ISBN (Electronic)	9781479953400
DOIs	https://doi.org/10.1109/ISCAS.2016.7527487
State	Published - 29 Jul 2016
Event	2016 IEEE International Symposium on Circuits and Systems, ISCAS 2016 - Montreal, Canada Duration: 22 May 2016 → 25 May 2016

Publication series

Name	Proceedings - IEEE International Symposium on Circuits and Systems
Volume	2016-July
ISSN (Print)	0271-4310

Conference

Conference	2016 IEEE International Symposium on Circuits and Systems, ISCAS 2016
Country/Territory	Canada
City	Montreal
Period	22/05/16 → 25/05/16

Access to Document

10.1109/ISCAS.2016.7527487

Cite this

Huang, Y. C., Huang, P.-T., Wu, S. L., Hu, Y. C., You, Y. H., Chen, M., Huang, Y. Y., Chang, H. C., Lin, Y. H., Duann, J.-R., Chiu, T.-W., Hwang, W., Chen, K.-N., Chuang, C.-T., & Chiou, J.-C. (2016). An ultra-high-density 256-channel/25mm2 neural sensing microsystem using TSV-embedded neural probes. In ISCAS 2016 - IEEE International Symposium on Circuits and Systems (pp. 1302-1305). Article 7527487 (Proceedings - IEEE International Symposium on Circuits and Systems; Vol. 2016-July). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISCAS.2016.7527487

Huang, Yu Chieh ; Huang, Po-Tsang ; Wu, Shang Lin et al. / An ultra-high-density 256-channel/25mm2 neural sensing microsystem using TSV-embedded neural probes. ISCAS 2016 - IEEE International Symposium on Circuits and Systems. Institute of Electrical and Electronics Engineers Inc., 2016. pp. 1302-1305 (Proceedings - IEEE International Symposium on Circuits and Systems).

@inproceedings{4267e8b7d26546d5a355fa7ee98ca881,

title = "An ultra-high-density 256-channel/25mm2 neural sensing microsystem using TSV-embedded neural probes",

abstract = "Highly integrated neural sensing microsystems are crucial to capture accurate signals for brain function investigations. In this paper, a 256-channel/25 mm2 neural sensing microsystem is presented based on through-silicon-via (TSV) 2.5D integration. This microsystem composes of dissolvable μ-needles, TSV-embedded μ-probes, 256-channel neural amplifiers, 11-bit area-power-efficient SAR ADCs and serializers. Based on the dissolvable μ-needles and TSV 2.5D integration, this microsystem can detect 256 ECoG/LFP signals within the small area of 5mm × 5mm. Additionally, the neural amplifier realizes 57.8dB gain with only 9.8μW for each channel, and the 9.7-bit ENOB of the SAR ADC at 32kS/s can be achieved with 0.42μW and 0.036 mm2. The overall power of this microsystem is only 3.79mW for 256-channel neural sensing.",

author = "Huang, {Yu Chieh} and Po-Tsang Huang and Wu, {Shang Lin} and Hu, {Yu Chen} and You, {Yan Huei} and Ming Chen and Huang, {Yan Yu} and Chang, {Hsiao Chun} and Lin, {Yen Han} and Jeng-Ren Duann and Tzai-Wen Chiu and Wei Hwang and Kuan-Neng Chen and Ching-Te Chuang and Jin-Chern Chiou",

note = "Publisher Copyright: {\textcopyright} 2016 IEEE.; 2016 IEEE International Symposium on Circuits and Systems, ISCAS 2016 ; Conference date: 22-05-2016 Through 25-05-2016",

year = "2016",

month = jul,

day = "29",

doi = "10.1109/ISCAS.2016.7527487",

language = "English",

series = "Proceedings - IEEE International Symposium on Circuits and Systems",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "1302--1305",

booktitle = "ISCAS 2016 - IEEE International Symposium on Circuits and Systems",

address = "美國",

}

Huang, YC, Huang, P-T, Wu, SL, Hu, YC, You, YH, Chen, M, Huang, YY, Chang, HC, Lin, YH, Duann, J-R , Chiu, T-W, Hwang, W, Chen, K-N, Chuang, C-T & Chiou, J-C 2016, An ultra-high-density 256-channel/25mm2 neural sensing microsystem using TSV-embedded neural probes. in ISCAS 2016 - IEEE International Symposium on Circuits and Systems., 7527487, Proceedings - IEEE International Symposium on Circuits and Systems, vol. 2016-July, Institute of Electrical and Electronics Engineers Inc., pp. 1302-1305, 2016 IEEE International Symposium on Circuits and Systems, ISCAS 2016, Montreal, Canada, 22/05/16. https://doi.org/10.1109/ISCAS.2016.7527487

An ultra-high-density 256-channel/25mm2 neural sensing microsystem using TSV-embedded neural probes. / Huang, Yu Chieh; Huang, Po-Tsang; Wu, Shang Lin et al.
ISCAS 2016 - IEEE International Symposium on Circuits and Systems. Institute of Electrical and Electronics Engineers Inc., 2016. p. 1302-1305 7527487 (Proceedings - IEEE International Symposium on Circuits and Systems; Vol. 2016-July).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - An ultra-high-density 256-channel/25mm2 neural sensing microsystem using TSV-embedded neural probes

AU - Huang, Yu Chieh

AU - Huang, Po-Tsang

AU - Wu, Shang Lin

AU - Hu, Yu Chen

AU - You, Yan Huei

AU - Chen, Ming

AU - Huang, Yan Yu

AU - Chang, Hsiao Chun

AU - Lin, Yen Han

AU - Duann, Jeng-Ren

AU - Chiu, Tzai-Wen

AU - Hwang, Wei

AU - Chen, Kuan-Neng

AU - Chuang, Ching-Te

AU - Chiou, Jin-Chern

PY - 2016/7/29

Y1 - 2016/7/29

N2 - Highly integrated neural sensing microsystems are crucial to capture accurate signals for brain function investigations. In this paper, a 256-channel/25 mm2 neural sensing microsystem is presented based on through-silicon-via (TSV) 2.5D integration. This microsystem composes of dissolvable μ-needles, TSV-embedded μ-probes, 256-channel neural amplifiers, 11-bit area-power-efficient SAR ADCs and serializers. Based on the dissolvable μ-needles and TSV 2.5D integration, this microsystem can detect 256 ECoG/LFP signals within the small area of 5mm × 5mm. Additionally, the neural amplifier realizes 57.8dB gain with only 9.8μW for each channel, and the 9.7-bit ENOB of the SAR ADC at 32kS/s can be achieved with 0.42μW and 0.036 mm2. The overall power of this microsystem is only 3.79mW for 256-channel neural sensing.

AB - Highly integrated neural sensing microsystems are crucial to capture accurate signals for brain function investigations. In this paper, a 256-channel/25 mm2 neural sensing microsystem is presented based on through-silicon-via (TSV) 2.5D integration. This microsystem composes of dissolvable μ-needles, TSV-embedded μ-probes, 256-channel neural amplifiers, 11-bit area-power-efficient SAR ADCs and serializers. Based on the dissolvable μ-needles and TSV 2.5D integration, this microsystem can detect 256 ECoG/LFP signals within the small area of 5mm × 5mm. Additionally, the neural amplifier realizes 57.8dB gain with only 9.8μW for each channel, and the 9.7-bit ENOB of the SAR ADC at 32kS/s can be achieved with 0.42μW and 0.036 mm2. The overall power of this microsystem is only 3.79mW for 256-channel neural sensing.

UR - http://www.scopus.com/inward/record.url?scp=84983390773&partnerID=8YFLogxK

U2 - 10.1109/ISCAS.2016.7527487

DO - 10.1109/ISCAS.2016.7527487

M3 - Conference contribution

AN - SCOPUS:84983390773

T3 - Proceedings - IEEE International Symposium on Circuits and Systems

SP - 1302

EP - 1305

BT - ISCAS 2016 - IEEE International Symposium on Circuits and Systems

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2016 IEEE International Symposium on Circuits and Systems, ISCAS 2016

Y2 - 22 May 2016 through 25 May 2016

ER -

Huang YC, Huang PT, Wu SL, Hu YC, You YH, Chen M et al. An ultra-high-density 256-channel/25mm2 neural sensing microsystem using TSV-embedded neural probes. In ISCAS 2016 - IEEE International Symposium on Circuits and Systems. Institute of Electrical and Electronics Engineers Inc. 2016. p. 1302-1305. 7527487. (Proceedings - IEEE International Symposium on Circuits and Systems). doi: 10.1109/ISCAS.2016.7527487

An ultra-high-density 256-channel/25mm2 neural sensing microsystem using TSV-embedded neural probes

Abstract

Publication series

Conference

Access to Document

Other files and links

Fingerprint

Cite this