An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-Prototype Programmable 2.5D/3D Packaging Technology

Jie Zhang, Wei Lu, Po Tsang Huang, Sih Han Li, Tsung Yi Hung, Shih Hsien Wu, Ming Ji Dai, I. Shan Chung, Wen Chao Chen, Chin Hung Wang, Shyh Shyuan Sheu, Hung Ming Chen, Kuan Neng Chen, Wei Chung Lo, Chih I. Wu

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

2.5D/3D integration combines multiple dies or chiplets into a single package through a silicon interposer and through-silicon-vias (TSVs). However, the wire routing of redistribution layer (RDL) on an interposer is time-consuming and expensive. Therefore, this work demonstrates the first programmable 2.5D/3D integration by an embedded multi-die active bridge (EMAB) chip for fast 2.5D/3D prototype proof. The EMAB chip is a programmable bridge and realized by a checkboard and super highways to connect I/Os of multiple dies. The control of programmable switches in EMAB is based on the information stored in the one-time programming (OTP) memory. To further improving the data rates of switches in the checkboard and super highway, a forward body-bias control is utilized to reduce the turn-on resistance. The maximum data rate of the super highway is up to 1Gbps and the data rate of the checkboard is 100Mbps through 20 I/O blocks. The proposed programmable advanced package technology is a fast time-to-market and low-cost 2.5D/3D integration solution for various IoT applications.

Original languageEnglish
Title of host publication2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages262-263
Number of pages2
ISBN (Electronic)9781665497725
DOIs
StatePublished - 2022
Event2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022 - Honolulu, United States
Duration: 12 Jun 202217 Jun 2022

Publication series

NameDigest of Technical Papers - Symposium on VLSI Technology
Volume2022-June
ISSN (Print)0743-1562

Conference

Conference2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022
Country/TerritoryUnited States
CityHonolulu
Period12/06/2217/06/22

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