An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-Prototype Programmable 2.5D/3D Packaging Technology

Jie Zhang; Wei Lu; Po Tsang Huang; Sih Han Li; Tsung Yi Hung; Shih Hsien Wu; Ming Ji Dai; I. Shan Chung; Wen Chao Chen; Chin Hung Wang; Shyh Shyuan Sheu; Hung Ming Chen; Kuan Neng Chen; Wei Chung Lo; Chih I. Wu

doi:10.1109/VLSITechnologyandCir46769.2022.9830188

An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-Prototype Programmable 2.5D/3D Packaging Technology

Jie Zhang, Wei Lu, Po Tsang Huang, Sih Han Li, Tsung Yi Hung, Shih Hsien Wu, Ming Ji Dai, I. Shan Chung, Wen Chao Chen, Chin Hung Wang, Shyh Shyuan Sheu, Hung Ming Chen, Kuan Neng Chen, Wei Chung Lo, Chih I. Wu

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

4 Scopus citations

Abstract

2.5D/3D integration combines multiple dies or chiplets into a single package through a silicon interposer and through-silicon-vias (TSVs). However, the wire routing of redistribution layer (RDL) on an interposer is time-consuming and expensive. Therefore, this work demonstrates the first programmable 2.5D/3D integration by an embedded multi-die active bridge (EMAB) chip for fast 2.5D/3D prototype proof. The EMAB chip is a programmable bridge and realized by a checkboard and super highways to connect I/Os of multiple dies. The control of programmable switches in EMAB is based on the information stored in the one-time programming (OTP) memory. To further improving the data rates of switches in the checkboard and super highway, a forward body-bias control is utilized to reduce the turn-on resistance. The maximum data rate of the super highway is up to 1Gbps and the data rate of the checkboard is 100Mbps through 20 I/O blocks. The proposed programmable advanced package technology is a fast time-to-market and low-cost 2.5D/3D integration solution for various IoT applications.

Original language	English
Title of host publication	2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	262-263
Number of pages	2
ISBN (Electronic)	9781665497725
DOIs	https://doi.org/10.1109/VLSITechnologyandCir46769.2022.9830188
State	Published - 2022
Event	2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022 - Honolulu, United States Duration: 12 Jun 2022 → 17 Jun 2022

Publication series

Name	Digest of Technical Papers - Symposium on VLSI Technology
Volume	2022-June
ISSN (Print)	0743-1562

Conference

Conference	2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022
Country/Territory	United States
City	Honolulu
Period	12/06/22 → 17/06/22

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10.1109/VLSITechnologyandCir46769.2022.9830188

Cite this

Zhang, J., Lu, W., Huang, P. T., Li, S. H., Hung, T. Y., Wu, S. H., Dai, M. J., Chung, I. S., Chen, W. C., Wang, C. H., Sheu, S. S., Chen, H. M., Chen, K. N., Lo, W. C., & Wu, C. I. (2022). An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-Prototype Programmable 2.5D/3D Packaging Technology. In 2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022 (pp. 262-263). (Digest of Technical Papers - Symposium on VLSI Technology; Vol. 2022-June). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/VLSITechnologyandCir46769.2022.9830188

Zhang, Jie ; Lu, Wei ; Huang, Po Tsang et al. / An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-Prototype Programmable 2.5D/3D Packaging Technology. 2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022. Institute of Electrical and Electronics Engineers Inc., 2022. pp. 262-263 (Digest of Technical Papers - Symposium on VLSI Technology).

@inproceedings{9002b74f46c54593af8100d342efef03,

title = "An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-Prototype Programmable 2.5D/3D Packaging Technology",

abstract = "2.5D/3D integration combines multiple dies or chiplets into a single package through a silicon interposer and through-silicon-vias (TSVs). However, the wire routing of redistribution layer (RDL) on an interposer is time-consuming and expensive. Therefore, this work demonstrates the first programmable 2.5D/3D integration by an embedded multi-die active bridge (EMAB) chip for fast 2.5D/3D prototype proof. The EMAB chip is a programmable bridge and realized by a checkboard and super highways to connect I/Os of multiple dies. The control of programmable switches in EMAB is based on the information stored in the one-time programming (OTP) memory. To further improving the data rates of switches in the checkboard and super highway, a forward body-bias control is utilized to reduce the turn-on resistance. The maximum data rate of the super highway is up to 1Gbps and the data rate of the checkboard is 100Mbps through 20 I/O blocks. The proposed programmable advanced package technology is a fast time-to-market and low-cost 2.5D/3D integration solution for various IoT applications.",

author = "Jie Zhang and Wei Lu and Huang, {Po Tsang} and Li, {Sih Han} and Hung, {Tsung Yi} and Wu, {Shih Hsien} and Dai, {Ming Ji} and Chung, {I. Shan} and Chen, {Wen Chao} and Wang, {Chin Hung} and Sheu, {Shyh Shyuan} and Chen, {Hung Ming} and Chen, {Kuan Neng} and Lo, {Wei Chung} and Wu, {Chih I.}",

note = "Publisher Copyright: {\textcopyright} 2022 IEEE.; 2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022 ; Conference date: 12-06-2022 Through 17-06-2022",

year = "2022",

doi = "10.1109/VLSITechnologyandCir46769.2022.9830188",

language = "English",

series = "Digest of Technical Papers - Symposium on VLSI Technology",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

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booktitle = "2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022",

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Zhang, J, Lu, W, Huang, PT, Li, SH, Hung, TY, Wu, SH, Dai, MJ, Chung, IS, Chen, WC, Wang, CH, Sheu, SS, Chen, HM , Chen, KN, Lo, WC & Wu, CI 2022, An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-Prototype Programmable 2.5D/3D Packaging Technology. in 2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022. Digest of Technical Papers - Symposium on VLSI Technology, vol. 2022-June, Institute of Electrical and Electronics Engineers Inc., pp. 262-263, 2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022, Honolulu, United States, 12/06/22. https://doi.org/10.1109/VLSITechnologyandCir46769.2022.9830188

An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-Prototype Programmable 2.5D/3D Packaging Technology. / Zhang, Jie; Lu, Wei; Huang, Po Tsang et al.
2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022. Institute of Electrical and Electronics Engineers Inc., 2022. p. 262-263 (Digest of Technical Papers - Symposium on VLSI Technology; Vol. 2022-June).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Lu, Wei

AU - Huang, Po Tsang

AU - Li, Sih Han

AU - Hung, Tsung Yi

AU - Wu, Shih Hsien

AU - Dai, Ming Ji

AU - Chung, I. Shan

AU - Chen, Wen Chao

AU - Wang, Chin Hung

AU - Sheu, Shyh Shyuan

AU - Chen, Hung Ming

AU - Chen, Kuan Neng

AU - Lo, Wei Chung

AU - Wu, Chih I.

PY - 2022

Y1 - 2022

N2 - 2.5D/3D integration combines multiple dies or chiplets into a single package through a silicon interposer and through-silicon-vias (TSVs). However, the wire routing of redistribution layer (RDL) on an interposer is time-consuming and expensive. Therefore, this work demonstrates the first programmable 2.5D/3D integration by an embedded multi-die active bridge (EMAB) chip for fast 2.5D/3D prototype proof. The EMAB chip is a programmable bridge and realized by a checkboard and super highways to connect I/Os of multiple dies. The control of programmable switches in EMAB is based on the information stored in the one-time programming (OTP) memory. To further improving the data rates of switches in the checkboard and super highway, a forward body-bias control is utilized to reduce the turn-on resistance. The maximum data rate of the super highway is up to 1Gbps and the data rate of the checkboard is 100Mbps through 20 I/O blocks. The proposed programmable advanced package technology is a fast time-to-market and low-cost 2.5D/3D integration solution for various IoT applications.

AB - 2.5D/3D integration combines multiple dies or chiplets into a single package through a silicon interposer and through-silicon-vias (TSVs). However, the wire routing of redistribution layer (RDL) on an interposer is time-consuming and expensive. Therefore, this work demonstrates the first programmable 2.5D/3D integration by an embedded multi-die active bridge (EMAB) chip for fast 2.5D/3D prototype proof. The EMAB chip is a programmable bridge and realized by a checkboard and super highways to connect I/Os of multiple dies. The control of programmable switches in EMAB is based on the information stored in the one-time programming (OTP) memory. To further improving the data rates of switches in the checkboard and super highway, a forward body-bias control is utilized to reduce the turn-on resistance. The maximum data rate of the super highway is up to 1Gbps and the data rate of the checkboard is 100Mbps through 20 I/O blocks. The proposed programmable advanced package technology is a fast time-to-market and low-cost 2.5D/3D integration solution for various IoT applications.

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DO - 10.1109/VLSITechnologyandCir46769.2022.9830188

M3 - Conference contribution

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T3 - Digest of Technical Papers - Symposium on VLSI Technology

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Zhang J, Lu W, Huang PT, Li SH, Hung TY, Wu SH et al. An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-Prototype Programmable 2.5D/3D Packaging Technology. In 2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022. Institute of Electrical and Electronics Engineers Inc. 2022. p. 262-263. (Digest of Technical Papers - Symposium on VLSI Technology). doi: 10.1109/VLSITechnologyandCir46769.2022.9830188

An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-Prototype Programmable 2.5D/3D Packaging Technology

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