TY - GEN
T1 - An Approximated Model of Boltzmann Transport Equation for Nano-Scale Thermal Analysis
AU - Chang, Chih Cheng
AU - Chiou, Hong Wen
AU - Lee, Yu Min
N1 - Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - Under the current trend of process evolution, nano-scale (transistor-level) thermal analysis will become more and more important. The thermal model framework of traditional thermal analysis is no longer adequate, so the mathematical model of nano-scale thermal analysis becomes the framework that must be included. To explore the physical behaviors of nano-scale thermal analysis, the mainstream of research depends on the Boltzmann transport equation (BTE). In these days, the existing solutions that are able to accurately solve the BTE are very time-consuming. In this work, we propose a method in the same way as solving the traditional heat transfer equation to obtain high accuracy results compared with the BTE for nano-scale thermal analysis. Compared with the state-of-The-Art BTE solver, the proposed method can speed up by at least 2, 000×.
AB - Under the current trend of process evolution, nano-scale (transistor-level) thermal analysis will become more and more important. The thermal model framework of traditional thermal analysis is no longer adequate, so the mathematical model of nano-scale thermal analysis becomes the framework that must be included. To explore the physical behaviors of nano-scale thermal analysis, the mainstream of research depends on the Boltzmann transport equation (BTE). In these days, the existing solutions that are able to accurately solve the BTE are very time-consuming. In this work, we propose a method in the same way as solving the traditional heat transfer equation to obtain high accuracy results compared with the BTE for nano-scale thermal analysis. Compared with the state-of-The-Art BTE solver, the proposed method can speed up by at least 2, 000×.
KW - Boltzmann transport equation
KW - heat transfer equation
KW - Nano-scale
KW - thermal analysis
UR - http://www.scopus.com/inward/record.url?scp=85140793845&partnerID=8YFLogxK
U2 - 10.1109/iTherm54085.2022.9899632
DO - 10.1109/iTherm54085.2022.9899632
M3 - Conference contribution
AN - SCOPUS:85140793845
T3 - InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
BT - Proceedings of the 21st InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2022
PB - IEEE Computer Society
T2 - 21st InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2022
Y2 - 31 May 2022 through 3 June 2022
ER -