Alignment and Transfer of Silver Nanowire Arrays onto Unconventional Substrates for Optoelectronic Devices via Dielectrophoresis Force

Yen Shuo Chen, Shun Yu Liu, Ching Chang Lin, Hua Tai Fan, Yu Chien Ko, Chun Chi Chen, Fu Hsiang Ko

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

As for AgNWs arrays for solar cell applications, our goal is to deposit AgNWs arrays on solar cells for enhancing photovoltaic conversion efficiency. The resulting alignment is ideal when AgNWs arrays are aligned on interdigitated electrodes by dielectrophoresis force in previous experiments, but not for aligning AgNWs arrays directly on silicon solar cell with pyramidal structure texture. In order to solve the limitations, the alignment is integrated with the transfer printing technique, and the fabrication approach is low-cost, fast, and scalable to large-area NW arrays, which offers flexible applications for developing NW-based devices with unconventional substrates.

Original languageEnglish
Title of host publication2024 International Conference on Electronics Packaging, ICEP 2024
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages255-256
Number of pages2
ISBN (Electronic)9784991191176
DOIs
StatePublished - 2024
Event23rd International Conference on Electronics Packaging, ICEP 2024 - Toyama, Japan
Duration: 17 Apr 202420 Apr 2024

Publication series

Name2024 International Conference on Electronics Packaging, ICEP 2024

Conference

Conference23rd International Conference on Electronics Packaging, ICEP 2024
Country/TerritoryJapan
CityToyama
Period17/04/2420/04/24

Keywords

  • Array
  • Dielectrophoresis force
  • Optoelectronics
  • Silver Nanowires
  • Transfer Printing

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