Advanced crystal component package with silicon TSV interposer using 3D integration and novel SU-8 polymer sealing bonding structure

Jian Yu Shih, Yen Chi Chen, Shih Wei Lee, Yu Chen Hu, Chih Hung Chiu, Chung Lun Lo, Chi Chung Chang, Kuan Neng Chen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

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Engineering & Materials Science