Adhesion properties of electroplating process between polyimide and metal layer for polymer/metal hybrid bonding

Cheng Hsien Lu; Yi Lun Yang; Chiao Pei Chen; Bin Ling Tsai; Kuan Neng Chen

doi:10.1109/TCPMT.2019.2942128

Adhesion properties of electroplating process between polyimide and metal layer for polymer/metal hybrid bonding

Cheng Hsien Lu, Yi Lun Yang, Chiao Pei Chen, Bin Ling Tsai, Kuan Neng Chen^*

^*Corresponding author for this work

Center for Semiconductor Technology Research

Research output: Contribution to journal › Article › peer-review

3 Scopus citations

Abstract

This article investigates the adhesion properties between the polyimide layers and the Ti/Cu layer after the electroplating process. The adhesion strength was evaluated by the four-point bending system, and the influence factors were confirmed by using different electroplating times and currents. The fracture interface after the four-point bending measurement was characterized, and the interface spectrum between the polyimide and the Ti/Cu layer was analyzed. The results showed that the modified polyimide-like material has better adhesion performance than the conventional polyimide. Moreover, the mechanism of degradation was proposed. As a result, the modified polyimide-like material can be applied in electroplating, a redistribution layer (RDL) formation, and packaging at the back-end-of-line processes.

Original language	English
Article number	8843892
Pages (from-to)	168-175
Number of pages	8
Journal	IEEE Transactions on Components, Packaging and Manufacturing Technology
Volume	10
Issue number	1
DOIs	https://doi.org/10.1109/TCPMT.2019.2942128
State	Published - Jan 2020

Keywords

Adhesion
X-ray photoelectron spectroscopy (XPS)
electroplating
polyimide

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@article{6fd2303201a54f449026d55049ed58a2,

title = "Adhesion properties of electroplating process between polyimide and metal layer for polymer/metal hybrid bonding",

abstract = "This article investigates the adhesion properties between the polyimide layers and the Ti/Cu layer after the electroplating process. The adhesion strength was evaluated by the four-point bending system, and the influence factors were confirmed by using different electroplating times and currents. The fracture interface after the four-point bending measurement was characterized, and the interface spectrum between the polyimide and the Ti/Cu layer was analyzed. The results showed that the modified polyimide-like material has better adhesion performance than the conventional polyimide. Moreover, the mechanism of degradation was proposed. As a result, the modified polyimide-like material can be applied in electroplating, a redistribution layer (RDL) formation, and packaging at the back-end-of-line processes.",

keywords = "Adhesion, X-ray photoelectron spectroscopy (XPS), electroplating, polyimide",

author = "Lu, {Cheng Hsien} and Yang, {Yi Lun} and Chen, {Chiao Pei} and Tsai, {Bin Ling} and Chen, {Kuan Neng}",

note = "Publisher Copyright: {\textcopyright} 2011-2012 IEEE.",

year = "2020",

month = jan,

doi = "10.1109/TCPMT.2019.2942128",

language = "English",

volume = "10",

pages = "168--175",

journal = "IEEE Transactions on Components, Packaging and Manufacturing Technology",

issn = "2156-3950",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "1",

}

TY - JOUR

T1 - Adhesion properties of electroplating process between polyimide and metal layer for polymer/metal hybrid bonding

AU - Lu, Cheng Hsien

AU - Yang, Yi Lun

AU - Chen, Chiao Pei

AU - Tsai, Bin Ling

AU - Chen, Kuan Neng

PY - 2020/1

Y1 - 2020/1

N2 - This article investigates the adhesion properties between the polyimide layers and the Ti/Cu layer after the electroplating process. The adhesion strength was evaluated by the four-point bending system, and the influence factors were confirmed by using different electroplating times and currents. The fracture interface after the four-point bending measurement was characterized, and the interface spectrum between the polyimide and the Ti/Cu layer was analyzed. The results showed that the modified polyimide-like material has better adhesion performance than the conventional polyimide. Moreover, the mechanism of degradation was proposed. As a result, the modified polyimide-like material can be applied in electroplating, a redistribution layer (RDL) formation, and packaging at the back-end-of-line processes.

AB - This article investigates the adhesion properties between the polyimide layers and the Ti/Cu layer after the electroplating process. The adhesion strength was evaluated by the four-point bending system, and the influence factors were confirmed by using different electroplating times and currents. The fracture interface after the four-point bending measurement was characterized, and the interface spectrum between the polyimide and the Ti/Cu layer was analyzed. The results showed that the modified polyimide-like material has better adhesion performance than the conventional polyimide. Moreover, the mechanism of degradation was proposed. As a result, the modified polyimide-like material can be applied in electroplating, a redistribution layer (RDL) formation, and packaging at the back-end-of-line processes.

KW - Adhesion

KW - X-ray photoelectron spectroscopy (XPS)

KW - electroplating

KW - polyimide

UR - http://www.scopus.com/inward/record.url?scp=85078228961&partnerID=8YFLogxK

U2 - 10.1109/TCPMT.2019.2942128

DO - 10.1109/TCPMT.2019.2942128

M3 - Article

AN - SCOPUS:85078228961

SN - 2156-3950

VL - 10

SP - 168

EP - 175

JO - IEEE Transactions on Components, Packaging and Manufacturing Technology

JF - IEEE Transactions on Components, Packaging and Manufacturing Technology

IS - 1

M1 - 8843892

ER -

Adhesion properties of electroplating process between polyimide and metal layer for polymer/metal hybrid bonding

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