Adhesion and material properties between polyimide and passivation layers for polymer/metal hybrid bonding in 3-D integration

Cheng Hsien Lu, Yi Tung Kho, Chiao Pei Chen, Bin Ling Tsai, Kuan-Neng Chen*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

5 Scopus citations

Abstract

This paper investigates polymer/metal hybrid bonding structure using conventional polyimide and modified polyimide-like material. Adhesion properties between bonding material and passivation layer were evaluated by four-point bending method, atomic force microscopy, water contact angle measurement, and X-ray photoelectron spectroscopy. Various annealing temperatures were applied to verify the reliability under thermal stress. The results show that the modified polyimide-like material with the curing temperature below 250 °C has better adhesion than the conventional polyimide. This modified polyimide material can be used in low-temperature hybrid bonding technology for advanced integration.

Original languageEnglish
Article number8626542
Pages (from-to)412-418
Number of pages7
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Volume9
Issue number3
DOIs
StatePublished - 1 Mar 2019

Keywords

  • Adhesion
  • X-ray photoelectron spectroscopy (XPS)
  • four-point bending
  • hybrid bonding
  • polyimide

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