A Wireless Multimodality System-on-a-Chip with Time-Based Resolution Scaling Technique for Chronic Wound Monitoring

Shao Yung Lu, Siang Sin Shan, Shih Che Kuo, Cheng Ze Shao, Yung Hua Yeh, I. Te Lin, Shu Ping Lin, Yu Te Liao

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    Abstract

    The healing process of chronic wounds (CWs) may last for weeks or even months. The process of CW healing relies on many highly regulated factors, such as C-reactive protein (CRP), uric acid (UA), and temperature, which require in-depth observations. Recently, multimodality electrochemistry has been used to acquire biological information pertaining to DNA sequencing [1], neurochemistry research [2] [3], and glucose monitoring [4]. Wound monitoring bandages integrated with modality sensors can provide a comprehensive understanding of the wound healing status [5]. Electrical stimulation has shown several advantages for CW healing, such as increasing the angiogenic response and antibacterial effects, during each healing phase [6]. The temperature index is used to measure the inflammation of the wound. Figure 18.4.1 shows the diagram of the wound healing monitoring bandage. To acquire a large range of biomarkers, the electrochemical instrument must have an extensive operational range, use various scanning methodologies, require low power consumption, and provide high detection resolutions. This work presents a CMOS multimodality system-on-a-chip (SoC) integrated with electrochemical sensors (ECH), a temperature sensor (TS), and a current stimulator (CS).

    Original languageEnglish
    Title of host publication2021 IEEE International Solid-State Circuits Conference, ISSCC 2021 - Digest of Technical Papers
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages282-284
    Number of pages3
    ISBN (Electronic)9781728195490
    DOIs
    StatePublished - 13 Feb 2021
    Event2021 IEEE International Solid-State Circuits Conference, ISSCC 2021 - San Francisco, United States
    Duration: 13 Feb 202122 Feb 2021

    Publication series

    NameDigest of Technical Papers - IEEE International Solid-State Circuits Conference
    Volume64
    ISSN (Print)0193-6530

    Conference

    Conference2021 IEEE International Solid-State Circuits Conference, ISSCC 2021
    Country/TerritoryUnited States
    CitySan Francisco
    Period13/02/2122/02/21

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