A TSV-based heterogeneous integrated neural-signal recording device with microprobe array

Lei Chun Chou; Shih Wei Lee; Chuan An Cheng; Po-Tsang Huang; Chih Wei Chang; Cheng Hao Chiang; Shang Lin Wu; Ching Te Chuang; Jin-Chern Chiou; Wei Hwang; Chung Hsi Wu; Kuo Hua Chen; Chi Tsung Chiu; Ho Ming Tong; Kuan-Neng Chen

doi:10.1109/VLSI-TSA.2014.6839692

A TSV-based heterogeneous integrated neural-signal recording device with microprobe array

Lei Chun Chou, Shih Wei Lee, Chuan An Cheng, Po-Tsang Huang, Chih Wei Chang, Cheng Hao Chiang, Shang Lin Wu, Ching Te Chuang, Jin-Chern Chiou, Wei Hwang, Chung Hsi Wu, Kuo Hua Chen, Chi Tsung Chiu, Ho Ming Tong, Kuan-Neng Chen

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

Highly integrated and miniaturized neural sensing microsystems are crucial for brain function investigation and neural prostheses realization. This paper presents a TSV-based heterogeneous integrated neural-signal recording device with microprobe array. By TSV, microprobe array and CMOS circuit make connection on the opposite sides of the chip. By measurement results on electrical characteristics of devices and TSV, this recording device is ready for bio-medical applications.

Original language	English
Title of host publication	Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2014
Publisher	IEEE Computer Society
ISBN (Print)	9781479922178
DOIs	https://doi.org/10.1109/VLSI-TSA.2014.6839692
State	Published - 1 Jan 2014
Event	2014 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2014 - Hsinchu, Taiwan Duration: 28 Apr 2014 → 30 Apr 2014

Publication series

Name	Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2014

Conference

Conference	2014 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2014
Country/Territory	Taiwan
City	Hsinchu
Period	28/04/14 → 30/04/14

Keywords

Bio-Signal Probe
CMOS MEMS
TSV

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10.1109/VLSI-TSA.2014.6839692

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Chou, L. C., Lee, S. W., Cheng, C. A., Huang, P-T., Chang, C. W., Chiang, C. H., Wu, S. L., Chuang, C. T., Chiou, J-C., Hwang, W., Wu, C. H., Chen, K. H., Chiu, C. T., Tong, H. M., & Chen, K-N. (2014). A TSV-based heterogeneous integrated neural-signal recording device with microprobe array. In Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2014 [6839692] (Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2014). IEEE Computer Society. https://doi.org/10.1109/VLSI-TSA.2014.6839692

Chou, Lei Chun ; Lee, Shih Wei ; Cheng, Chuan An et al. / A TSV-based heterogeneous integrated neural-signal recording device with microprobe array. Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2014. IEEE Computer Society, 2014. (Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2014).

@inproceedings{0a2317eb88db48f9895952fdba66d074,

title = "A TSV-based heterogeneous integrated neural-signal recording device with microprobe array",

abstract = "Highly integrated and miniaturized neural sensing microsystems are crucial for brain function investigation and neural prostheses realization. This paper presents a TSV-based heterogeneous integrated neural-signal recording device with microprobe array. By TSV, microprobe array and CMOS circuit make connection on the opposite sides of the chip. By measurement results on electrical characteristics of devices and TSV, this recording device is ready for bio-medical applications.",

keywords = "Bio-Signal Probe, CMOS MEMS, TSV",

author = "Chou, {Lei Chun} and Lee, {Shih Wei} and Cheng, {Chuan An} and Po-Tsang Huang and Chang, {Chih Wei} and Chiang, {Cheng Hao} and Wu, {Shang Lin} and Chuang, {Ching Te} and Jin-Chern Chiou and Wei Hwang and Wu, {Chung Hsi} and Chen, {Kuo Hua} and Chiu, {Chi Tsung} and Tong, {Ho Ming} and Kuan-Neng Chen",

year = "2014",

month = jan,

day = "1",

doi = "10.1109/VLSI-TSA.2014.6839692",

language = "English",

isbn = "9781479922178",

series = "Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2014",

publisher = "IEEE Computer Society",

booktitle = "Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2014",

address = "United States",

note = "null ; Conference date: 28-04-2014 Through 30-04-2014",

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Chou, LC, Lee, SW, Cheng, CA, Huang, P-T, Chang, CW, Chiang, CH, Wu, SL, Chuang, CT, Chiou, J-C, Hwang, W, Wu, CH, Chen, KH, Chiu, CT, Tong, HM & Chen, K-N 2014, A TSV-based heterogeneous integrated neural-signal recording device with microprobe array. in Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2014., 6839692, Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2014, IEEE Computer Society, 2014 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2014, Hsinchu, Taiwan, 28/04/14. https://doi.org/10.1109/VLSI-TSA.2014.6839692

A TSV-based heterogeneous integrated neural-signal recording device with microprobe array. / Chou, Lei Chun; Lee, Shih Wei; Cheng, Chuan An et al.

Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2014. IEEE Computer Society, 2014. 6839692 (Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2014).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Chou, Lei Chun

AU - Lee, Shih Wei

AU - Cheng, Chuan An

AU - Huang, Po-Tsang

AU - Chang, Chih Wei

AU - Chiang, Cheng Hao

AU - Wu, Shang Lin

AU - Chuang, Ching Te

AU - Chiou, Jin-Chern

AU - Hwang, Wei

AU - Wu, Chung Hsi

AU - Chen, Kuo Hua

AU - Chiu, Chi Tsung

AU - Tong, Ho Ming

AU - Chen, Kuan-Neng

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AB - Highly integrated and miniaturized neural sensing microsystems are crucial for brain function investigation and neural prostheses realization. This paper presents a TSV-based heterogeneous integrated neural-signal recording device with microprobe array. By TSV, microprobe array and CMOS circuit make connection on the opposite sides of the chip. By measurement results on electrical characteristics of devices and TSV, this recording device is ready for bio-medical applications.

KW - Bio-Signal Probe

KW - CMOS MEMS

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BT - Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2014

PB - IEEE Computer Society

Y2 - 28 April 2014 through 30 April 2014

ER -

Chou LC, Lee SW, Cheng CA, Huang P-T, Chang CW, Chiang CH et al. A TSV-based heterogeneous integrated neural-signal recording device with microprobe array. In Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2014. IEEE Computer Society. 2014. 6839692. (Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2014). doi: 10.1109/VLSI-TSA.2014.6839692

A TSV-based heterogeneous integrated neural-signal recording device with microprobe array

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Keywords

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