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A TSV-based bio-signal package with μ-probe array
Lei Chun Chou
, Shih Wei Lee
,
Po-Tsang Huang
, Chih Wei Chang
, Cheng Hao Chiang
, Shang Lin Wu
, Ching Te Chuang
,
Jin-Chern Chiou
, Wei Hwang
, Chung Hsi Wu
, Kuo Hua Chen
, Chi Tsung Chiu
, Ho Ming Tong
,
Kuan-Neng Chen
International College of Semiconductor Technology
Institute of Electronics
Department of Electrical and Computer Engineering
Research output
:
Contribution to journal
›
Article
›
peer-review
5
Scopus citations
Overview
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Keyphrases
Biosignals
100%
Bonding Technology
20%
CMOS Devices
20%
Neural Sensing
20%
Neural Signals
20%
Package System
20%
Packaging Technology
20%
Probe Array
100%
Quality Signal
20%
Sensing Applications
20%
Sensor Device
20%
Signal Probe
20%
Signal Quality
20%
Through Silicon via
100%
Wire Bonding
20%
Wire-bonding Technique
20%
Engineering
Biosignal
100%
Bonding Wire
40%
Interconnects
20%
Opposite Side
20%
Sensing Application
20%
Signal Quality
20%
Three Dimensional Integrated Circuits
20%