A TSV-based bio-signal package with μ-probe array

Lei Chun Chou; Shih Wei Lee; Po-Tsang Huang; Chih Wei Chang; Cheng Hao Chiang; Shang Lin Wu; Ching Te Chuang; Jin-Chern Chiou; Wei Hwang; Chung Hsi Wu; Kuo Hua Chen; Chi Tsung Chiu; Ho Ming Tong; Kuan-Neng Chen

doi:10.1109/LED.2013.2293399

A TSV-based bio-signal package with μ-probe array

Lei Chun Chou, Shih Wei Lee, Po-Tsang Huang, Chih Wei Chang, Cheng Hao Chiang, Shang Lin Wu, Ching Te Chuang, Jin-Chern Chiou, Wei Hwang, Chung Hsi Wu, Kuo Hua Chen, Chi Tsung Chiu, Ho Ming Tong, Kuan-Neng Chen

Research output: Contribution to journal › Article › peer-review

5 Scopus citations

Abstract

Bio-signal probes providing stable observation with high quality signals are crucial for understanding how the brain works and how the neural signal transmits. Due to the weak and noisy characteristics of bio-signals, the connected interconnect length between the sensor and CMOS has significant impact on the bio-signal quality. In addition, long interconnections with wire bonding technique introduce noises and lead to bulky packaged systems. This letter presents an implantable through-silicon via (TSV) technology to connect sensors and CMOS devices located on the opposite sides of the chip for brain neural sensing applications. With the elimination of traditional wire bonding and packaging technologies, the quality of bio-signal can be greatly improved.

Original language	English
Article number	6684308
Pages (from-to)	256-258
Number of pages	3
Journal	Ieee Electron Device Letters
Volume	35
Issue number	2
DOIs	https://doi.org/10.1109/LED.2013.2293399
State	Published - Feb 2014

Keywords

CMOS MEMS
TSV
bio-signal probe

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10.1109/LED.2013.2293399

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title = "A TSV-based bio-signal package with μ-probe array",

abstract = "Bio-signal probes providing stable observation with high quality signals are crucial for understanding how the brain works and how the neural signal transmits. Due to the weak and noisy characteristics of bio-signals, the connected interconnect length between the sensor and CMOS has significant impact on the bio-signal quality. In addition, long interconnections with wire bonding technique introduce noises and lead to bulky packaged systems. This letter presents an implantable through-silicon via (TSV) technology to connect sensors and CMOS devices located on the opposite sides of the chip for brain neural sensing applications. With the elimination of traditional wire bonding and packaging technologies, the quality of bio-signal can be greatly improved.",

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author = "Chou, {Lei Chun} and Lee, {Shih Wei} and Po-Tsang Huang and Chang, {Chih Wei} and Chiang, {Cheng Hao} and Wu, {Shang Lin} and Chuang, {Ching Te} and Jin-Chern Chiou and Wei Hwang and Wu, {Chung Hsi} and Chen, {Kuo Hua} and Chiu, {Chi Tsung} and Tong, {Ho Ming} and Kuan-Neng Chen",

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doi = "10.1109/LED.2013.2293399",

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AU - Chou, Lei Chun

AU - Lee, Shih Wei

AU - Huang, Po-Tsang

AU - Chang, Chih Wei

AU - Chiang, Cheng Hao

AU - Wu, Shang Lin

AU - Chuang, Ching Te

AU - Chiou, Jin-Chern

AU - Hwang, Wei

AU - Wu, Chung Hsi

AU - Chen, Kuo Hua

AU - Chiu, Chi Tsung

AU - Tong, Ho Ming

AU - Chen, Kuan-Neng

PY - 2014/2

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A TSV-based bio-signal package with μ-probe array

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Keywords

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