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A stress analysis of transferred thin-GaN light-emitting diodes fabricated by Au-Si wafer bonding

  • Bo Wen Lin*
  • , Nian Jheng Wu
  • , Yew-Chuhg Wu
  • , S. C. Hsu
    • *Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

9 Scopus citations

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