A stress analysis of transferred thin-GaN light-emitting diodes fabricated by Au-Si wafer bonding

Bo Wen Lin*, Nian Jheng Wu, Yew-Chuhg Wu, S. C. Hsu

*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

8 Scopus citations

Fingerprint

Dive into the research topics of 'A stress analysis of transferred thin-GaN light-emitting diodes fabricated by Au-Si wafer bonding'. Together they form a unique fingerprint.

Keyphrases

Engineering

Material Science